Global Embedded Die Packaging Market

Global Embedded Die Packaging Market is expected to reach US$ XX Bn by 2026 from US$ XX Bn in 2019 at a CAGR of 18 % during the forecast period.

The report includes an analysis of the impact of COVID-19 lockdown on the revenue of market leaders, followers, and disruptors. Since the lockdown was implemented differently in various regions and countries; the impact of the same is also seen differently by regions and segments. The report has covered the current short-term and long-term impact on the market, and it would help the decision-makers to prepare the outline and strategies for companies by region.
Embedded Die Packaging Definition:

Embedded Die is defined as a passive component or an integrated circuit that is placed or formed on an inner layer of an organic circuit board, module, or chip package, such that it is buried inside the completed structure, rather than on the top or bottom.
Global Embedded Die Packaging Market Dynamics:

The combination of increased I/O density, reduced footprint, and multi-die capability within a single platform makes embedded die an attractive solution. Additionally, embedded die products offer flexible memory configurations with routing above and below the die in addition to standard JEDEC pin-outs, while also providing integration of disparate die technologies onto a single platform. Thus, a new era of innovation has resulted in increased die content and functionality moving to the packaging industry to address the resulting integration gap, which has boosted the growth of the Global Embedded Die Packaging Market.

Traditionally, the act of embedding die has been burdened by factors such as dedicating a known good die to a poor yielding substrate build-up process, long cycle-time, and the difficulty to inspect, test, and rework the embedded die structure. Recently, however, companies are making significant advancements to minimize these issues and develop an infrastructure to support the growing demand for embedded die products.

Shifting the die embedding to mid-stream in the circuit build-up process helps to reduce die yield loss. In addition, leveraging mature, large format thin-film buildup and substrate lamination processes, in conjunction with high throughput die attach and panel-based assembly equipment helps to ensure a more robust and efficient process, which is acting as a driving factor to the growth of the Global Embedded Die Packaging Market.

Modularization has become a critical focus throughout the semiconductor industry resulting in sophisticated packaging approaches to address the desire for miniaturization and increased levels of integration. At the lower end, the long-standing incumbent technology that has customarily addressed this, Multichip Modules (MCM), leverages traditional multichip attach methods using standard and advanced organic substrates. At the highest end, the most advanced technology platform leverages silicon interposers with metal vias to provide a highly integrated version of the incumbent, but at a cost premium. In the middle, the Embedded Die platform provides perhaps the most compelling argument, especially from the mobile perspective. The embedded die platform cuts a clear path between each of the previous two technology platforms mentioned. The embedded die platform provides an opportunity for true System-in-Package (SiP) architectures with much higher levels of integration than the incumbent MCM at much lower costs.

Traditional multichip attach methods using standard and advanced organic substrates are limited to 2D planar scaling for MCM applications. The most advanced technology platform (2.5D TSV) is burdened by high packaging costs and an immature supply chain. The embedded die provides an alternate path for true heterogeneous integration in a 3D architecture within a cost structure that is attractive for consumer application. Both integrated device manufacturers companies are projecting significant growth opportunities for embedded die products, primarily for mobile applications.
Global Embedded Die Packaging Market Segment Analysis:

The report groups the Global Embedded Die Packaging Market in different segments by Platform, application, end-user, and region to forecast the revenues and analyze the market share of each segment over the forecast period.

Global Embedded Die Packaging Market

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Based on end-use, the Global Embedded Die Packaging Market is segmented into Consumer Electronics, IT and Telecommunication, Automotive, Healthcare and Other. The Consumer Electronics segment was dominant in 2019 and is expected to command a market share of xx% by 2026. Embedding of semiconductor chips into organic substrates allows a very high degree of miniaturization by stacking multiple layers of embedded components, superior electrical performance by short and geometrically well-controlled interconnects as well as a homogeneous mechanical environment of the chips, resulting in good reliability.

Based on application, the Global Embedded Die Packaging Market is segmented into Smartphones and Tablets, Medical and Wearable Devices, Industrial Devices, Security Devices, and Others.
Global Embedded Die Packaging Market Regional Insights:

Global Embedded Die Packaging Market Regional Insights

Europe is expected to command the largest market share of xx% by 2026

With the funded European Project “EmPower” in the frame of CATRENE (Cluster for Application and Technology Research in Europe on Nanoelectronics) academic and industrial players have formed a consortium to develop the next generation of embedded power packages and power modules, which have increased the demand of the embedded die packaging in the region.
In the frame of the EU-funded project “HIDING DIES” partners from industry and research organizations have developed an embedding technology, which is based on the “Chip-in-Polymer”. Many such adoptions of technological advancements by manufacturers have boosted the growth of the production of embedded die packaging in the region.

The objective of the report is to present a comprehensive analysis of the Global Embedded Die PackagingMarket to the stakeholders in the industry. The past and current status of the industry with forecasted market size and trends are presented in the report with the analysis of complicated data in simple language.

The report covers all the aspects of the industry with a dedicated study of key players that include market leaders, followers, and new entrants. PORTER, SVOR, PESTEL analysis with the potential impact of micro-economic factors of the market have been presented in the report. External as well as internal factors that are supposed to affect the business positively or negatively have been analyzed, which will give a clear futuristic view of the industry to the decision-makers.

The report also helps in understanding the Global Embedded Die Packaging Market dynamics, structure by analyzing the market segments and projects Global Embedded Die Packaging Market size. Clear representation of competitive analysis of key players by product, price, financial position, product portfolio, growth strategies, and regional presence in the Global Embedded Die Packaging Market make the report investor’s guide.
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Global Embedded Die Packaging Market Regional Insights

Global Embedded Die Packaging Market Key Players

• ASE Group,
• AT&S,
• Fujitsu Limited,
• General Electric,
• Infineon Technologies AG,
• Microsemi Corporation,
• STMicroelectronics,
• TDK Corporation,
• Texas Instruments Incorporation
• Toshiba Corporation
• Amkor Technology, Inc.
• Fujikura Ltd.
• Taiwan Semiconductor Manufacturing Company LimitedThis report submitted by Maximize market Research Company
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